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Intel Corporation hiring Graduate Manufacturing Engineering Intern


Company Name: Intel Corporation

Job Description: Graduate Manufacturing Engineering Intern

Job Number: 705742

Description

Job Description: Come intern with Intel's Mobile Communications Group. Responsibilities may be quite diverse in a technical nature and will vary significantly depending on the unique needs of the role, U.S. experience and education requirements. Job assignments may be for the summer or for short periods throughout the school year.

The selected candidate will be part of the Manufacturing Operations team in the Mobile and Communications Group, located in Oregon. In this position, the Manufacturing Engineer (ME) will have broad-based responsibility for enabling ODM and/or Contract Manufacture capability and readiness to produce Smartphone or Tablet based products. The ME will work with responsible design, engineering, and TD groups on ensuring the appropriate manufacturing collateral is developed and delivered. They will own Mfg Risk assessments of the CM/ODM or Technology Development sites and developing and executing a risk mitigation strategy to ensure successful product launch. The ME will own defining & driving the manufacturing flow requirements including packaging, manual assembly, inspection guides & requirements.

This ME will also drive collaborative design reviews of the card and assemblies during the design cycle to ensure product manufacturability, yields, cost effectiveness, and efficiency through the use of DFx rule analysis and other related tools. The ME will establish the appropriate DFx rules for this market segment by validating current DFx rules against the requirements and capabilities in this market segment and making the appropriate modifications or tradeoffs as necessary.

The ideal candidate should exhibit the following behavioral traits:
I. Creative & effective problem solving skills
II. Effective organizational skills to track multiple issues & activities across multiple sites


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:
I. Must be pursuing an MS or PhD in Electrical Engineering, Computer Engineering or Computer Science

Preferred Qualifications:
I. Minimum of 3 months experience with PCB design, layout, and critical to manufacturing parameters, circuit board fabrication, design and/or assembly techniques
II. Minimum of 3 months experience with SMT, Wave, and Manual assembly processes
III. Minimum of 3 months experience with Design for manufacturing techniques
IV. Minimum of 3 months experience with Industry standard workmanship and repair standards - IPC series

Job Category: Manufacturing

Primary Location: USA-Oregon, Hillsboro

Full/Part Time: Full Time

Job Type: Student/Intern

Regular/Temporary: Temporary

Apply Before: Jun 29, 2013
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